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Description

  • BGA Reballing Stencil Template - This repair kit is specially designed for Samsung s..
  • Excellent replacement of IC or BGA rework and reassembly..
  • Finely machined steel sheet that can be heated by a heat ..
  • The reballing stencil template can be easily and quickly imed into the BGA / IC..
  • Made of high-quality steel, which is strong and durable, ensures a long service life..
Specification: Type: Reballing Stencil Template Compatible brand: For Samsung Suitable models:S For Samsung Galaxy S3 I9300 For Samsung Galaxy S4 I9500 For Samsung Galaxy S5 For Samsung Galaxy S6 For Samsung Galaxy S6 edge For Samsung Galaxy S7 For Samsung Note 4 For Samsung Note 5 For Samsung Note 6 Material: Steel Weight: Approx. 94g / 3.3oz Size: Approx. 20.5 * 13 * 0.4cm / 8.1 * 5.1 * 0.2in Package list: 9 * Reballing Stencil Templates ( 1 * For Samsung Galaxy S3 I9300 1 * For Samsung Galaxy S4 I9500 1 * For Samsung Galaxy S5 1 * For Samsung Galaxy S6 1 * For Samsung Galaxy S6 edge 1 * For Samsung Galaxy S7 1 * For Samsung Note 4 1 * For Samsung Note 5 1 * For Samsung Note 6 ) Notes: 1. Please note that this product is suitable for professionals who know what they are doing and we do not hold any responsibility for the wrong installation. 2. Please allow slight error due to manual measurement. Thanks for your kind understanding.

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Zopsc 9PCS BGA Reballing Stencils Multi-Purpose High Precision IC Chipset Template Repairing Tool for Samsung s

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