The thermal conductivity of the PTI-G4512 reaches 2.5W/mK, and the thermal resistance is 0.1°C cm2/W. With this attribute, you can expect better screen printing. Bond lines are also thinner and the material is easy to apply. Semiconductor manufacturers apply heat conduction silicone to the gap between the chip and heat sink, leading the heat of microprocessing equipment, GPU and other important parts to the heat sink. Today, demand for thermal conduction products is growing in the market such as LED, flat panel displays, communications, and automotive products. The PTI-G4512 combines a high efficiency silicone polymer with a softer filler particle to reduce oil stains on the heat sink. Most of the heat conduction products from other manufacturers use large and hard particles, so it is easy to scratch the heat sink during the manufacturing process. Compared to many high heat resistance greases, this new thermal conductive material can be expected to handle a wider range of temperatures, and for those who are concerned about the appearance of microprocessing equipment and GPU heat sink, you can expect to improve the problem of oil stains.
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